Electronics Assembly & Packaging >> Kulicke & Soffa, Singapore

Wedge Bond Asterion

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    Enhanced Capability Hybrid Wedge Bonder
    The Asterion™ wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together, these deliver heightened productivity, bonding quality, and reliability.

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      Detailed Specs

      The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multisegmented bonding includes flexible tools to deliver an optimized bonding process.

      Key Advantages:

      Large bondable area (300 x 300 mm)
      Multi-lane capability
      Consistent process results
      Low cost-of-ownership with reduced preventive maintenance