Single Wafer Cleaning systems

The EVG Single Wafer Cleaning Systems employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG300 series systems are versatile R&D, cassette to cassette type systems for flexible cleaning procedures and 300 mm capability. The EVG300 series systems can be combined with EVG’s wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.