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Aurion based on the know-how and lots of experience in RF technology has developed a series of very flexible Reactive Ion Etching (RIE) systems with an outstanding cost-performance ratio. The range of products offered contains three system sizes for different substrates, throughput and etching rates.
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Detailed Specs
Aurion’s Reactive Ion Etching System (RIE) offers high capacity of up to 25 wafers (Ø 150 mm) or 20 wafers (Ø 200 mm) and despite a small footprint (max. 1.5 m² in the clean room) a throughput of more than 100,000 wafers per year is possible even without an expensive automatic handling system. Some of the important features are:
– Vacuum chamber made of stainless steel or aluminum
– Vacuum pumps for corrosive gases including oil mist filter and oil return system
– Gas inlet system with up to 4 mass flow controllers
– Tailor made gas shower for optimised distribution
– Pressure measurement with capacitive or Pirani gauge (depending on the requirements)
– Impedance matching of the RF power through matching networks with automatic tuning designed and manufactured by AURION
– Power-Split (when using more than one cathode)
– DC bias control for equal bias potential at more than one cathode
– Semiautomatic or PC control including data logging.
