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ULTECH’s RTA systems are available in either Atmospheric Pressure or Low pressure system and offers wide operating temperature band. ULTECH System’s are popular due to Low Cost Design model especially for R&D purpose.
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Detailed Specs
ULTECH’s Rapid Thermal Annealing (RTA) system features include;
– Substrate size & load capacity : 4inch wafer – 1 wafer/batch
– Temperature range : RT~1,000 ℃
– Substrate holder : Quartz (pin)
– Rotary pump
– Manual angle valve
– MFC: O2(1slm), N2(1slm)
– Manual control (switch panel)
RTA offered by ULTECH includes: Single Side heating and Double side heating