Semiconductor & Solar >> EV Group, Austria

Mask Aligner Systems

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    EVG invented the world’s first double-sided mask alignment system in 1985 and have ever since pioneered and set the industry standards in double-side lithography and aligned wafer bonding.

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      EV Group R&D and Automated Mask Aligner maintains the lead in the area of mask aligner by the continuous introduction of new mask aligner generations providing the most advanced lithography technology. Accommodating wafers and substrates up to 300mm, varying in size, shape and thickness, the EV Group´s mask alignment systems target MEMS, wafer bumping, chip scale packaging as well as all applications in compound semiconductors, power devices and photovoltaic. Automated mask alignment systems are optimized for highest throughput, highest mean time between failures and most reliable print gap settings.