Electronics Assembly & Packaging >> DISCO Hi-Tech, Japan

DFP8141 Fully Automatic Polisher

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    CMP polisher designed to process hard-to-process materials such as sapphire and SiC
    Φ200 mm
    1 axis, 2 chuck tables
    Wafer Thinning
    Stress Releaf

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      Detailed Specs

      Fully automatic operation
      The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.

      For small workpieces made of difficult-to-process materials
      The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.

      A transfer system which supports three workpiece configurations
      The transfer system accepts three workpiece configurations: single wafer transfer, substrate transfer, and frame transfer.