Electronics Assembly & Packaging >> DISCO Hi-Tech, Japan

DFL7341 Fully Automatic Laser Saw

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    DFL7341

    Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
    Φ200 mm
    Stealth Dicing™
    SDBG
    SDTT

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      Detailed Specs

      DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
      Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
      This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.

      Height adjustment function
      Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage.

      Wafer shape recognition
      Wafer shape is measured using a high-resolution sensor to singulate at the optimal processing area.

      Compatibility with various materials
      High-quality processing can be achieved for sapphire, SiC, and GaAs using laser oscillators suited for each material.

      DFL7341