Semiconductor & Solar >> Nano-Master, Inc. USA

Deep Reactive Ion Etching System(DRIE)

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    Nanomaster’s NDR-4000 is Deep Reactive Ion Etching System (DRIE) with cryogenic wafer cooling and biasable platen and a 8” Inductively Coupled Plasma Source. It has 500L/sec turbo and process pressures can be as low as few mTorr.

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      Detailed Specs

      NANO-MASTER DRIE systems incorporate a planar ICP source for high density plasma generation. Our systems have the ability to be used both with Cryo etch and Bosch processes that can create deep penetration, steep-sided holes and trenches in wafers with high aspect ratios. Some of the unique features are:

      – NM-ICP downstream high density shower-head plasma source
      – Compatible with Bosch and Cryo etch processees
      – 13″” Aluminum hard anodized chamber
      – Reduced chamber volume ensuring high gas conductance and short step times
      – Up to 200mm substrates
      – Mechanical chuck with He backside cooling
      – 1kW RF power supply with Auto Tuner for ICP source
      – 600W RF power supply with Auto Tuner for substrate bias
      – RIE mode for low etch rate applications
      – PC based fully automatic recipe or manually driven control system
      – State of the art user interface
      – EMO protection and safety interlock