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Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
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Detailed Specs
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces up to 8″ in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.
Space-saving design
Machine dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm
Precision grinding
Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification).
Unlimited materials
Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components.
Easy operation
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation can be performed just by touching the icons.
Special options for a variety of needs
Height gauge
One or two-probe height gauge (option)
In-feed grinding
Workpieces up to Φ300 mm (option)
Frame grinding
8″ frame grinding (option)
Creep-feed grinding
Workpieces up to Φ200 mm (user-specified spec.)
High-precision applications
Processes silicon and compound semiconductors for analysis.
Grinds resin for CSP and WL-CSP
Improves the planarity of lithium tantalate and lithium niobate
Processes green ceramics and sapphire
