Automatic Solder Paste Printer

Features:

1.High stability optical system

•Advanced up/down visual system, independent controllable and adjusted lighting, high speed mobile camera lens, precisely alignment for the PCB and template and make sure that the printing accuracy is ±0.025mm.
•Four-way light source adjustable, with uniform illumination and the perfect image collection, making the various types of Mark points can be a very good identification (including the rugged Mark point), to meet the tin, Gold- plated, spray tin, FPC, and other types of different colors of the PCB.

2.High-efficiency stencil cleaning system

• The bottom of the board can be cleaned by manual or automatically. The clean function for the bottom of board is automatic and no need any assists. It can be programmed to control the dry, wet or vacuum cleaning. The cleaning time interval can be free to set. It can clean all the solder paste inside the board holes and guarantee the high quality printing.
• The new wiping system ensures full contact with the stencil, and the increased vacuum suction ensures that the solder paste remaining in the mesh is effectively removed, and the effective automatic cleaning function is achieved.

3.Intelligent scraper system

• Suspended printing head which is designed specially in high rigid structure. The scraper pressure, speed and movement are controlled by the computer, which can maintain the even and stability of the printing. Besides, the structure of scraper beam is light and well-formed.
• Sound and light alarm function. It can indicate the reason of the fault.
• Can deal with the PCB base board no matter it is single side or double side.
• Programmable and independent direct- coupled stepper motor control, Built-in precision pressure control system.

4.Multi-functional PCB handling device

• There is a multifunctional device to deal with boards. The device can automatically positioning and pick up various size and thickness PCB boards.
It has mobile magnetic thimble, vacuum platform and vacuum chamber, which can avoid board deformation effectively and make sure the even of printing.
• Simple and reliable PCB positioning system: Adaptive PCB board thickness, software tunable flexible side pressure and magnetic supporting device.

5.Excellent 2D inspection

• 2D solder paste printing quality check and analysis function can inspect fast on printing imperfection, such as the offset, insufficient solder paste, missing printing and solder paste bridging etc. It can check the printing performance and insure the printing quality.

6.Electronic control system

• Good man-machine interaction environment, simple operation. It is easy to learn and operate.
• It can print 0.3mm spacing bonding pad perfectly.