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SMT Assembly Meets Backend Module Manufacturing
With actual placement speeds of up to 140,000 passives per hour and bonding speeds up to 27,000 flip chips per hour and defect rates lower than 1 defect per million, the K&S AP-Hybrid solutions give you the best of both worlds.
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Detailed Specs
Wafer Level Packaging (WLP)
Bonding Flip Chips and/or Passives onto wafers or panels
Processing wafers sizes up to 12″ and larger
Cam-X and Secs-Gem compatible
Feeding from wafer, waffle pack, tray or tape and reel
Full controlled Placement force for thin Flip Chips or low profile passives
Full traceability
Fine pitch Copper Pillar Bumps
MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
Up to 27,000 cph (IPC) Flip Chip bonding speeds
Up to 140,000 cph (IPC) Chip shooting speeds
High quality pick and placement process
7 Micron for Flips Chips, Die and Wafer Level Packages
Full controlled Placement force for thin Flip Chips or low profile passives
Feeding from wafer, waffle pack, tray or tape and reel
POP (Package-on-Package)
Die or BGA stacking at the highest throughput on smallest footprint
Feeding from wafer, waffle pack, tray or tape and reel
Full force control with every Placement at all placement height
Easy to exchange linear flux unit
