Electronics Assembly & Packaging >> Kulicke & Soffa, Singapore

Advanced Packaging (Flip-Chip) Katalyst

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    Highest Accuracy, Highest UPH Flip-Chip Performance
    Kulicke & Soffa’s Katalyst™ delivers the industry’s highest accuracy and speed for flip-chip placement. Its hardware and technology enable < 3 μm accuracy on substrate or wafer, achieving the best Cost-of-Ownership in the industry.

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      Detailed Specs

      Advanced automation and software features have been employed to
      achieve exceptional Ease-of-use, allowing the Katalyst to act like a
      single-nozzle machine.

      KEY FEATURES
      • Dual Gantry with Multi-nozzle Placement
      • Multi-die Pickup and Multi-die Dip Flux
      • Industry Leading 15K UPH
      • 50 μm Thin-die Pick Capability
      • < 3 μm Accuracy
      • Single-nozzle Setup and Teach
      • Machine Health Check Diagnostic
      • Complete Material and Process Tracking
      • Automated Accuracy Stability Feature
      • Electronic Vibration Cancellation Feature
      • In-situ Flux-dip Quality Inspection
      • Fast Tool-less Application Changeover
      • Automated Die Ejector, Pick Tool, and
      Place Tool Changers
      • Industry 4.0 Compliant