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Nanomaster Dual system series comprises of configurations;
– Sputtering and Reactive Ion Etching (RIE)
– Plasma Enhanced Chemical Vapor Deposition (PECVD) and Reactive Ion Etching(RIE)
– Sputtering and Plasma Enhanced Chemical Vapor Deposition (PECVD)
– Sputtering and Thermal Evaporation System
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Detailed Specs
Nanomaster Dual system is a computer controlled combined systems with a stainless steel cabinet. These systems includes all the necessary process and safety controls, pumps, power supplies, and instrumentation. It is designed with the objectives of ease of use and ease of maintenance, while providing ultimate cleanliness with minimal contamination from virtual leaks, out-gassing, and backstreaming.