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E-beam evaporation is used to deposit a wide variety of materials. Commonly used for such optical thin film applications as laser optics and solar panels to eyeglasses and architectural glass, e-beam evaporation provides the optical, electrical, and mechanical qualities required. E-beam evaporation provides a high material utilization efficiency compared to other PVD processes, reducing costs.
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Denton Vacuum’s e-beam evaporation systems are delivered with programmable sweep controllers to provide optimal heating of the evaporation materials and minimized contamination from a crucible. Multi-pocket e-beam sources can be provided to sequentially evaporate different evaporation materials without breaking vacuum for multi-layer film designs. Systems are configured with thin film deposition controllers for automated single and multiple-layer process control. Real-time optical monitoring and control hardware and software can be fully integrated into a system to allow for automated process control for critical optical coating applications.
E-beam evaporation is controllable, repeatable and compatible with the use of an ion assist source to enhance the desired thin film performance characteristics. Denton has developed two systems for e-beam evaporation applications, one offering a versatile configuration for R&D and pilot production, the other targeting high-volume production with application-specific configurations. We have over 50 years of experience in delivering turn-key process solutions for metallization, lift-off, and precision optical coatings. The e-beam solutions below provide many options to meet your application’s requirements.
INTEGRITY:
The Integrity is configured for demanding optical, semiconductor and compound semiconductor applications. A temperature management system supports a fluid-cooled substrate stage, which enables for small grains and textured films.
EXPLORER:
The Explorer provides the ultimate in flexibility, offering a range of configurations and deposition technologies, including e-beam evaporation, resistance evaporation, sputtering, and ion-assisted deposition.