Semiconductor & Solar >> SPTS Technologies

Metal Deposition

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    SPTS Technologies, a KLA company, designs, manufactures, sells, and supports Etch, PVD, CVD and MVD capital equipment, providing advanced wafer processing technologies and solutions for the semiconductor and microelectronics industry. End-market applications include micro-electromechanical systems (MEMS), advanced packaging, LED, high speed RF device IC’s and power semiconductors.

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      Sigma® Deposition Systems
      The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD
      Metal Deposition Technologies
      • Standard PVD – conventional sputter modules for low topography features
      • Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features
      • C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier
      Advantages of SPTS PVD
      • Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.
      • Planar target with full face erosion
      o avoids re-sputtering, reduces particle contamination
      o improves target life
      • Rapid target change (<5mins), with common magnetron increases uptime
      • Reliable handling of fragile, thinned or bowed wafers
      • “”Super Uniformity”” option available for specialist applications
      • Multi-wafer degas to increase throughput for long (low temp) degas applications
      • Common software for 200mm and 300mm systems – ease of use