Electronics Assembly & Packaging >> Kulicke & Soffa, Singapore

Die Attach ISTACK S+

I am interested in this product

    Your Name (required)

    Your Email (required)

    Contact Number

    Product Name

    Close Form

    High Performance & High Productivity Die Attach
    The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance.

    I am interested in this product

      Your Name (required)

      Your Email (required)

      Contact Number

      Product Name

      Close Form

      Downloads

      Detailed Specs

      Features & Options

      High Accuracy kit (5 μm)
      Thin Substrate handling kit (< 100 μm)
      Mapping Functions (Substrate / Wafer)
      Wafer / Substrate contamination removal kit
      OHT / AGV kit
      SMEMA kit
      UV (In-Situ / Post-Bond)
      Tool Contamination monitoring kit